JPH0610649Y2 - コイルと回路基板の組立構成体 - Google Patents
コイルと回路基板の組立構成体Info
- Publication number
- JPH0610649Y2 JPH0610649Y2 JP1988162284U JP16228488U JPH0610649Y2 JP H0610649 Y2 JPH0610649 Y2 JP H0610649Y2 JP 1988162284 U JP1988162284 U JP 1988162284U JP 16228488 U JP16228488 U JP 16228488U JP H0610649 Y2 JPH0610649 Y2 JP H0610649Y2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- circuit board
- radiation fin
- assembly structure
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 claims description 20
- 238000002788 crimping Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 230000001939 inductive effect Effects 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988162284U JPH0610649Y2 (ja) | 1988-12-14 | 1988-12-14 | コイルと回路基板の組立構成体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988162284U JPH0610649Y2 (ja) | 1988-12-14 | 1988-12-14 | コイルと回路基板の組立構成体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0282008U JPH0282008U (en]) | 1990-06-25 |
| JPH0610649Y2 true JPH0610649Y2 (ja) | 1994-03-16 |
Family
ID=31445970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988162284U Expired - Lifetime JPH0610649Y2 (ja) | 1988-12-14 | 1988-12-14 | コイルと回路基板の組立構成体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610649Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142327A (ja) * | 2001-10-31 | 2003-05-16 | Furukawa Electric Co Ltd:The | 非接触給電装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5940733Y2 (ja) * | 1979-03-15 | 1984-11-20 | 三洋電機株式会社 | トランスの取付装置 |
| JPS5811214U (ja) * | 1981-07-15 | 1983-01-25 | 株式会社ケンウッド | 広帯域トランスの取付構造 |
-
1988
- 1988-12-14 JP JP1988162284U patent/JPH0610649Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0282008U (en]) | 1990-06-25 |
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